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Buried CMOS Nanowires Kept a Superconducting Hot Spot
Thermal measurements favored interfacial phonon cooling over a simple longitudinal model.
Summary
Thermal measurements favored interfacial phonon cooling over a simple longitudinal model.
Titanium-nitride nanowires fabricated in a commercial 22-nanometer FD-SOI process remained strongly hysteretic despite burial beneath the metal stack. Across lengths and temperatures, the retrapping current fit a two-channel thermal model with a predicted crossover near 3.5 micrometers. The measurements characterize test structures, not a complete detector product.
Why it matters
Thermal measurements favored interfacial phonon cooling over a simple longitudinal model.
Limits and context
- The measurements characterize test structures, not a complete detector product.
Key claims
Thermal measurements favored interfacial phonon cooling over a simple longitudinal model.
Qualification: The measurements characterize test structures, not a complete detector product.
Evidence: source-2026-09-29-020
Sources
- arXiv preprint 2609.35624arXiv · primary research
Corrections
No corrections have been recorded for this story.